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In addition to SMT and SMD, modern PCB design also involves advanced packaging technologies such as Ball Grid Array (BGA). Different types of BGA packages are widely used in high-performance electronic devices where a large number of input/output connections are required in a limited space. Common BGA types include Plastic BGA (PBGA), Ceramic BGA (CBGA), Tape BGA (TBGA), and Flip-Chip BGA (FCBGA). These packages offer improved electrical performance,